ES offers a wide range of control system hardware and software solutions based on years of experience in the aerospace field. The photograph shows a Prototype Smart Node designed with discrete High Temperature components. This design is being converted into a System On Chip (SOC) High Temperature Silicon On Insulator (SOI) Application Specific Integrated Circuit (ASIC) device. The resulting Smart Node will be a miniaturized Multi Chip Module (MCM).

Representative High Temperature Multi-chip Module (MCM) Developed by Honeywell with support from the U.S. Department of Energy.